Zohioliin Duu Tatah

Zohioliin Duu Tatah





             

Zohioliin Duu Tatah


Zohioliin duu tatah ; Tatgevriin dood hemzheeg 500 myanga bolgoyo. Personal blog. 2721 people like it; Aydaa hÒ¯muÒ¯s min Amdral saikhan. Musician/ban… ·. 1.4K … ·. 1 hour ago … Türkçe Çeviri. Turkish language … Turkce Jogu. Turkish language Türkçe Çeviri | VK is the largest European social network with more than 100 million active users . Our goal is to keep old friends, ex-classmates, neighbors and colleagues in touch Türkçe Çeviri Turkish online. Turkish language video lessons. Learn Turkish online. Turkish Guide to Learning Turkish.

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100.15.0.01.1Togloom tataj 100.15.0.01.3Hit  . Zohioliin duu tatah mp3 download free. size:6.33 mb. get it 100.15.0.01.3Hit Zohioliin duu tatah mp3 download free size:6.33 mb. get it Miimsin.Mongol duu zohioliin duu tataj song audio download. Free download. 6.33 Mb. 100.15.0.01.3Hit download: Zohioliin duu tatah – Zohioliin Duu Song. MP3. Chords. Duu MONGOL ZOHIOIIN DUU KLIP TATAH VIDEO DOWNLOAD TANIi duulah durtai duunuud – Niitiin duuchdiin negdsen toglolt: pin. Duunuud chin bolon SoloNyoi. Ung ji yul KKONGU. Fashool. Free Download. 00:10. Carver. 1. Field of the Invention The present invention relates to an integrated circuit, and more particularly to a semiconductor integrated circuit having a power supply line lead. 2. Description of the Related Art FIG. 18 is a schematic plan view showing the structure of a conventional semiconductor integrated circuit. In FIG. 18, reference numeral 1 designates a semiconductor chip, which is subjected to flip-chip mounting. A power supply line lead 2 is provided on the surface side of the semiconductor chip 1 and formed in a shape of a plate member. The power supply line lead 2 is bonded to a power supply electrode 3. The power supply line lead 2 is provided to have a thicker portion 2A and a thinner portion 2B, which are different in thickness. The thicker portion 2A is formed thick to have high electrical conductivity and the thinner portion 2B is formed thin to have low electrical conductivity. The thicker portion 2A is provided on the surface side of the semiconductor chip 1. The thinner portion 2B is formed in a lead of a lead frame. As a semiconductor integrated circuit operates, the power supply electrode 3 generates heat. Since the power supply line lead 2 is formed of the thick portion 2A, heat dissipation from c6a93da74d


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